Electronics Assembly


Electronics Assembly

Whether your product is new to market, is being assembled in another part of the world and you need to transfer to North America or is growing in market share and you need to increase capacity-Sinec Technologies can help you seamlessly integrate your product into our manufacturing facility. We manage a win-win culture & environment, establishing healthy & long term relationships with our employees, suppliers and of course our customers.


Time to test and time to market are critical in development of new products. Our prototype service area is committed to helping you reach both of these goals in a timely manner so you can get your technological product to the world.

  • Quick turn
  • Low-volume
  • MOQ 1 board

Mass Production

  • Product transfer
  • NPI project management
  • High, Med, Low Volume. High mix, medium or low volume
  • Global supply chain management
  • Certified & bilingual engineering staff
  • Product & material traceability systems

Technical Capabilities

  • SPI (automated solder paste inspection)
  • AOI (automated optical inspection)
  • Pin through-hole assembly
  • Wave solder machines
  • X ray analysis
  • ICT (in circuit test)
  • FVT (functional test)
  • CC application (conformal coating)
  • Panasonic & Fuji Pick and Place Platforms
  • Depenalization routers
  • Custom packaging solutions


  • IATF 16949 Automotive Quality QMS
  • ISO 9001:2015 Quality Management Systems
  • IPC Class 2&3 Assembly Process Quality Standard