User Bar First

This is a debugging block

Branding

This is a debugging block

Menu

This is a debugging block

Preface First

This is a debugging block

Blog

Content

This is a debugging block

Case Study Comparing the Solderability of a Specific Pb Vapor Phase and Convection Reflow (Part 2)

Experiment Process

One of the major goals of this study was to control as much as possible the previous factors with the purpose of observing any difference in wetting behavior caused by the reflow technique. The samples used as the solderable metal surfaces were 10 Cu Blocks. Each Cu Block had the dimensions: 38 mm X 38 mm X 3.2 mm. Figure 4 shows an example of the Cu Block Sample.

Five of the Cu Blocks went through Vapor Phase Reflow and five of the blocks went throug. Convection Reflow. A separate Cu Block had three thermocouples (TC’S) attached to it and was used to set up the recipes of the thermal reflow processes.
The recipes developed were optimized for Pb Free SAC soldering parameters. All three TC’s were attached to the topside surface and were adhered from one corner to the opposite corner. The Vapor Phase Reflow machine was manufactured by R&D Technical Services. The Vapor Phase machine was a batch unit that had a fully enclosed topside/bottomside convection heat pre-heat zone, and a reflow zone containing the vapor well. Both in the pre-heat and reflow zone Nitrogen (Inert) gas was supplied. The following was the recipe used:

  •     Boiling Fluid – 240 perfluorinated heat transfer fluid
  •     Pre-Heat - Oven at 290°C for 175 Seconds
  •     Reflow Dwell – 115 Seconds
  •     Vapor Flash Off Dwell – 25 Seconds
  •     Cool Dwell – 400 Seconds

The Convection Reflow machine used was an inline unit from Heller Industries. The Convection
Reflow oven had 12 Topside/Bottomside Zones and had Nitrogen (Inert) gas atmosphere. The Nitrogen source was same for both the Vapor Phase and Convection Reflow Machines. The following was the recipe used:

Inspection To Improve Lead-free Solder Technologies

Inspection To Improve Lead-free Solder Technologies

Lorem ipsum dolor sit amet.

Consectetur adipiscing elit. Sed a lectus arcu. Duis adipiscing consectetur lectus, sed aliquet augue bibendum et. Maecenas in nisl id nunc mattis blandit vel eget turpis. Sed eget orci et dolor ultrices rhoncus. Vivamus commodo nulla mi, eu luctus nibh lacinia eget. Sed diam massa, rhoncus sed felis ac, vulputate interdum lorem. Integer non sodales tortor. Vivamus quis velit a mi imperdiet aliquet et non enim. Sed venenatis a libero egestas commodo. Maecenas non mattis mauris. Ut vel lacinia elit, vel vulputate nulla.

  • Turpis posuere fasela
  • Vestibulum cursus, neque ut condimentum
  • Sed diam massa

Proin sed diam non turpis posuere fermentum in faucibus massa. Vestibulum cursus, neque ut condimentum rhoncus, purus massa porta odio, et faucibus orci nisl in eros. Vestibulum vel enim nec diam molestie tincidunt. Duis cursus egestas sapien, sit amet lacinia libero fringilla nec. Phasellus elementum nibh imperdiet est porttitor suscipit. Sed in massa aliquam, adipiscing lorem sit amet, gravida magna. Aliquam vitae feugiat justo. Integer non tempor ipsum. Nullam cursus elit diam, id malesuada enim semper in. Interdum et malesuada fames ac ante ipsum primis in faucibus. Nulla nec congue neque, non bibendum metus. Curabitur ut turpis eu sapien vulputate convallis et a leo. Curabitur porttitor mi elit, quis mattis orci commodo sit amet. Nullam enim velit, imperdiet id orci in, lobortis condimentum libero.

Sed ac ultrices enim. Proin non vulputate urna, in porta purus. Fusce pharetra scelerisque velit, id molestie metus. Maecenas vestibulum id enim suscipit auctor. Suspendisse tellus dui, egestas at quam eget, fermentum aliquam dolor. Proin urna nisl, semper a libero eu, porttitor tempus nulla. Aliquam sit amet risus nibh. Pellentesque habitant morbi tristique senectus et netus et malesuada fames ac turpis egestas. Mauris mollis leo quis lobortis eleifend. Cras laoreet turpis ac velit volutpat dictum. Curabitur eget tortor vitae ante tristique pulvinar et eget felis. Phasellus at adipiscing augue.

Postscript First

This is a debugging block

Postscript Second

This is a debugging block